[IEEE IEEE International Integrated Reliability Workshop - Lake Tahoe, CA, USA (21-24 Oct. 2002)] IEEE International Integrated Reliability Workshop Final Report, 2002. - Time-dependent dielectric breakdown evaluation of deep trench capacitor with sidewall hemispherical, polysilicon grains for gigabit DRAM technology
Fen Chen,, Parkinson, P., McStay, I., Settlemyer, K., Reviere, R., Tews, H., Seitz, M., Min-soo Kim,, Ruprecht, M., Jinghong Li,, Jammy, R., Strong, A.Year:
2002
Language:
english
DOI:
10.1109/irws.2002.1194236
File:
PDF, 304 KB
english, 2002