[IEEE 2011 IEEE Applied Power Electronics Conference and Exposition - APEC 2011 - Fort Worth, TX, USA (2011.03.6-2011.03.11)] 2011 Twenty-Sixth Annual IEEE Applied Power Electronics Conference and Exposition (APEC) - Ultra compact, low thermal impedance and high reliability module structure with SiC Schottky Barrier Diodes
Ikeda, Yoshinari, Nashida, Norihiro, Horio, Masafumi, Takubo, Hiromu, Takahashi, YoshikazuYear:
2011
Language:
english
DOI:
10.1109/apec.2011.5744760
File:
PDF, 482 KB
english, 2011