![](/img/cover-not-exists.png)
Thermally Conductive MgO-Filled Epoxy Molding Compounds
Wereszczak, Andrew A., Morrissey, Timothy G., Volante, Charles N., Farris, Phillip J., Groele, Robert J., Wiles, Randy H., Wang, HsinVolume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2281212
Date:
December, 2013
File:
PDF, 3.19 MB
english, 2013