Thermally Conductive MgO-Filled Epoxy Molding Compounds

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 12 Vol. 3; Iss. 12

Thermally Conductive MgO-Filled Epoxy Molding Compounds

Wereszczak, Andrew A., Morrissey, Timothy G., Volante, Charles N., Farris, Phillip J., Groele, Robert J., Wiles, Randy H., Wang, Hsin
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2281212
Date:
December, 2013
File:
PDF, 3.19 MB
english, 2013
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