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[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Electromigration in Large Volume Solder Joints
Meier, Karsten, Roellig, Mike, Wiese, Steffen, Goette, Carsten, Deml, Ulrich, Wolter, Klaus-JuergenYear:
2007
Language:
english
DOI:
10.1109/esime.2007.359954
File:
PDF, 7.02 MB
english, 2007