[IEEE 2008 IEEE International Symposium on Electronics and the Environment (ISEE) - San Francisco, CA, USA (2008.05.19-2008.05.22)] 2008 IEEE International Symposium on Electronics and the Environment - Using FMEA and FAHP to risk evaluation of green components
Chia-Wei Hsu,, Hu, Allen H., Wei-Cheng Wu,Year:
2008
Language:
english
DOI:
10.1109/isee.2008.4562937
File:
PDF, 246 KB
english, 2008