Study of adhesive flip chip bonding process and failure...

Microelectronics Reliability 2004 Vol. 44; Iss. 4

Study of adhesive flip chip bonding process and failure mechanisms of ACA joints

A. Seppälä, E. Ristolainen
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Volume:
44
Year:
2004
Language:
english
Pages:
10
DOI:
10.1016/j.microrel.2003.07.003
File:
PDF, 489 KB
english, 2004
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