Integrating thick copper/Black Diamond™ layer in CMOS...

Microelectronics Reliability 2004 Vol. 44; Iss. 4

Integrating thick copper/Black Diamond™ layer in CMOS interconnect process for RF passive components

Guo Lihui, Zhang Yibin, Su Yong Jie Jeffrey
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Volume:
44
Year:
2004
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2003.12.006
File:
PDF, 328 KB
english, 2004
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