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[IEEE Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' - Austin, TX, USA (2-4 Oct. 1995)] Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' - Void formation in flip-chip solder bumps. I

Goenka, L., Achari, A.
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Year:
1995
Language:
english
DOI:
10.1109/iemt.1995.526084
File:
PDF, 1.07 MB
english, 1995
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