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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - TSV reliability model under various stress tests
Lwo, Ben-Je, Frank,, Lin, M.-S., Huang, Kuo-HsinYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897350
File:
PDF, 2.33 MB
english, 2014