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[IEEE 2013 IEEE International Ultrasonics Symposium (IUS) - Prague, Czech Republic (2013.07.21-2013.07.25)] 2013 IEEE International Ultrasonics Symposium (IUS) - Development of a highly attenuative backing for ultrasonic transducers with periodic arrangement of polymeric rods inside the backing
Byungkuk Bae,, Hyungkeun Lee,, Susung Lee,, Wonseok Lee,, Yongrae Roh,Year:
2013
Language:
english
DOI:
10.1109/ultsym.2013.0283
File:
PDF, 2.29 MB
english, 2013