Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu...

IEEE Transactions on Components Packaging and Manufacturing Technology 2012 / 09 Vol. 2; Iss. 9

Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First Benefits

Kumbhat, Nitesh, Choudhury, Abhishek, Mehrotra, Gaurav, Raj, Pulugurtha Markondeya, Sundaram, Venky, Tummala, Rao
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Volume:
2
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2012.2192120
Date:
September, 2012
File:
PDF, 1.42 MB
english, 2012
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