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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Evolution of Ag3Sn compounds in solidification of eutectic Sn-3.5Ag solder
Lee, Hwa-Teng, Chen, Yin-Fa, Hong, Ting-Fu, Shih, Ku-TaYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270669
File:
PDF, 947 KB
english, 2009