Prediction of Delamination Related IC & Packaging Reliability Problems
W.D. van Driel, M.A.J. van Gils, R.B.R. van Silfhout, G.Q. ZhangVolume:
45
Year:
2005
Language:
english
Pages:
6
DOI:
10.1016/j.microrel.2005.07.065
File:
PDF, 596 KB
english, 2005