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Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis
Ming-Chih Yew, Chan-Yen Chou, Kuo-Ning ChiangVolume:
47
Year:
2007
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2007.07.043
File:
PDF, 1.43 MB
english, 2007