[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Solder joint shape and standoff height prediction and integration with FEA-based methodology for reliability evaluation
Sidharth,, Blish, R., Natekar, D.Year:
2002
Language:
english
DOI:
10.1109/ectc.2002.1008345
File:
PDF, 675 KB
english, 2002