Advances in the drop-impact reliability of solder joints...

Advances in the drop-impact reliability of solder joints for mobile applications

E.H. Wong, S.K.W. Seah, W.D. van Driel, J.F.J.M. Caers, N. Owens, Y.-S. Lai
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Volume:
49
Year:
2009
Language:
english
Pages:
11
DOI:
10.1016/j.microrel.2008.12.001
File:
PDF, 883 KB
english, 2009
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