Advances in the drop-impact reliability of solder joints for mobile applications
E.H. Wong, S.K.W. Seah, W.D. van Driel, J.F.J.M. Caers, N. Owens, Y.-S. LaiVolume:
49
Year:
2009
Language:
english
Pages:
11
DOI:
10.1016/j.microrel.2008.12.001
File:
PDF, 883 KB
english, 2009