Reliability study of board-level lead-free interconnections...

Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact

Bo Zhang, Han Ding, Xinjun Sheng
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Volume:
49
Year:
2009
Language:
english
Pages:
7
DOI:
10.1016/j.microrel.2009.02.024
File:
PDF, 1.69 MB
english, 2009
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