Investigation of stress distribution in via bottom of...

Microelectronics Reliability 2009 Vol. 49; Iss. 9-11

Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling

Johar Ciptokusumo, Kirsten Weide-Zaage, Oliver Aubel
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Volume:
49
Year:
2009
Language:
english
Pages:
6
DOI:
10.1016/j.microrel.2009.07.043
File:
PDF, 1.46 MB
english, 2009
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