Experimental study of filling behaviors in the underfill...

Experimental study of filling behaviors in the underfill encapsulation of a flip-chip

Meng-Fu Shih, Wen-Bin Young
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Volume:
49
Year:
2009
Language:
english
Pages:
8
DOI:
10.1016/j.microrel.2009.07.056
File:
PDF, 6.25 MB
english, 2009
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