Design and optimization of thermo-mechanical reliability in...

Design and optimization of thermo-mechanical reliability in wafer level packaging

X.J. Fan, B. Varia, Q. Han
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Volume:
50
Year:
2010
Language:
english
Pages:
11
DOI:
10.1016/j.microrel.2009.11.010
File:
PDF, 1.67 MB
english, 2010
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