Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing
A. Aubert, J.P. Rebrassé, L. Dantas de Morais, N. Labat, H. FrémontVolume:
50
Year:
2010
Language:
english
Pages:
4
DOI:
10.1016/j.microrel.2010.07.036
File:
PDF, 554 KB
english, 2010