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Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling
P.A. Agyakwa, M.R. Corfield, L. Yang, J.F. Li, V.M.F. Marques, C.M. JohnsonVolume:
51
Year:
2011
Language:
english
Pages:
10
DOI:
10.1016/j.microrel.2010.08.018
File:
PDF, 1.81 MB
english, 2011