[IEEE Proceedings of the 1999 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.99TH8394) - Singapore (1999.07.9-1999.07.9)] Proceedings of the 1999 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.99TH8394) - Detection of underfill epoxy defects in flip chip packages with the aid of SAM, parallel polishing and FIB

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