[IEEE 2011 IEEE International Symposium on Electromagnetic Compatibility - EMC 2011 - Long Beach, CA, USA (2011.08.14-2011.08.19)] 2011 IEEE International Symposium on Electromagnetic Compatibility - Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems
Xie, Biancun, Swaminathan, Madhavan, Han, Ki Jin, Xie, JianyongYear:
2011
Language:
english
DOI:
10.1109/isemc.2011.6038277
File:
PDF, 2.59 MB
english, 2011