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[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Comparison between two Surface Insulation Resistance tests regarding different soldering techniques
Pantazica, Mihaela, Marghescu, Cristina, Svasta, Paul, Varzaru, Gaudentiu, Plotog, Ioan, Tamas, Cosmin AndreiYear:
2012
Language:
english
DOI:
10.1109/siitme.2012.6384366
File:
PDF, 956 KB
english, 2012