[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Bondability, moldability, and reliability of very-long, multi-height Au bonding wires
Tok, C.W., Rulloda, O., Calpito, D.R.M., Wulff, F.W., Pasamanero, E.Year:
2006
Language:
english
DOI:
10.1109/eptc.2006.342769
File:
PDF, 1.14 MB
english, 2006