[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Accelerating the effects of aging on the reliability of lead free solder joints in a quantitative fashion
Venkatadri, Vikram, Yin, Liang, Xing, Yan, Cotts, Eric, Srihari, K., Borgesen, PeterYear:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074045
File:
PDF, 1.41 MB
english, 2009