![](/img/cover-not-exists.png)
[IEEE 2002 IEEE International Reliability Physics Symposium Proceedings. 40th Annual - Dallas, TX, USA (7-11 April 2002)] 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320) - Investigation of via-dominated multi-modal electromigration failure distributions in dual damascene Cu interconnects with a discussion of the statistical implications
Gill, J., Sullivan, T., Yankee, S., Barth, H., von Glasow, A.Year:
2002
Language:
english
DOI:
10.1109/RELPHY.2002.996652
File:
PDF, 577 KB
english, 2002