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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV)
Sridharan, Vivek, Min, Sunghwan, Sundaram, Venky, Sukumaran, Vijay, Hwang, Seunghyun, Chan, Hunter, Liu, Fuhan, Nopper, Christian, Tummala, RaoYear:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490917
File:
PDF, 789 KB
english, 2010