[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Development of advanced fan-out wafer level package (embedded Wafer Level BGA) packaging
Jin, Yonggang, Teysseyre, Jerome, Baraton, Xavier, Yoon, S.W., Lin, Yaojian, Marimuthu, Pandi C.Year:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474589
File:
PDF, 1.86 MB
english, 2012