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[IEEE IEEE 2002 International Interconnect Technology Conference - Burlingame, CA, USA (3-5 June 2002)] Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) - Voiding in ultra porous low-k materials proposed mechanism, detection and possible solutions
Jacobs, T., Brennan, K., Carpio, R., Mosig, K., Jing-Cheng Lin,, Cox, H., Mlynko, W., Fourcher, J., Bennett, J., Wolf, J., Augur, R., Gillespie, P.Year:
2002
Language:
english
DOI:
10.1109/iitc.2002.1014944
File:
PDF, 225 KB
english, 2002