Future Microprocessors and Off-Chip SOP Interconnect

IEEE Transactions on Advanced Packaging 2004 / 05 Vol. 27; Iss. 2

Future Microprocessors and Off-Chip SOP Interconnect

Hofstee, H.P.
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Volume:
27
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2004.830355
Date:
May, 2004
File:
PDF, 90 KB
english, 2004
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