![](/img/cover-not-exists.png)
[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Thermal induced warpage characterization for printed circuit boards with shadow moire system
Ying, Ming, Chia, Yew, Mohtar, Arman, Yin, Tiang, Chuah, SaiYear:
2006
Language:
english
DOI:
10.1109/eptc.2006.342727
File:
PDF, 755 KB
english, 2006