[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Assembly and reliability challenges in 3D integration of 28nm FPGA die on a large high density 65nm passive interposer
Chaware, Raghunandan, Nagarajan, Kumar, Ramalingam, SureshYear:
2012
Language:
english
DOI:
10.1109/ECTC.2012.6248841
File:
PDF, 657 KB
english, 2012