[IEEE Proceedings of International Reliability Physics Symposium - Dallas, TX, USA (1996.04.30-1996.05.2)] Proceedings of International Reliability Physics Symposium RELPHY-96 - iTEM: a chip-level electromigration reliability diagnosis tool using electrothermal timing simulation
Chin-Chi Teng,, Yi-Ka,, Rosenbaum, E., Sung-Mo Kang,Year:
1996
Language:
english
DOI:
10.1109/relphy.1996.492078
File:
PDF, 684 KB
english, 1996