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[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Influence of heat sink mounting procedure on package reliability
Zhongfa Yuan,, Yong Liu,, Luk, Timwah, Irving, ScottYear:
2008
Language:
english
DOI:
10.1109/esime.2008.4525067
File:
PDF, 621 KB
english, 2008