![](/img/cover-not-exists.png)
[IEEE 2009 20th International Zurich Symposium on Electromagnetic Compatibility - Zurich, Switzerland (2009.01.12-2009.01.16)] 2009 20th International Zurich Symposium on Electromagnetic Compatibility - Chip-Package Co-modeling & Verification of Noise Coupling & Generation in CMOS DC/DC Buck Converter
Song, Taigon, Kim, Jiseong, Pak, Junso, Kim, JounghoYear:
2009
Language:
english
DOI:
10.1109/emczur.2009.4783446
File:
PDF, 3.21 MB
english, 2009