[IEEE 2009 20th International Zurich Symposium on...

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[IEEE 2009 20th International Zurich Symposium on Electromagnetic Compatibility - Zurich, Switzerland (2009.01.12-2009.01.16)] 2009 20th International Zurich Symposium on Electromagnetic Compatibility - Chip-Package Co-modeling & Verification of Noise Coupling & Generation in CMOS DC/DC Buck Converter

Song, Taigon, Kim, Jiseong, Pak, Junso, Kim, Joungho
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Year:
2009
Language:
english
DOI:
10.1109/emczur.2009.4783446
File:
PDF, 3.21 MB
english, 2009
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