[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Progress towards the development of novel fabrication and assembly methods for the next generation of ultrasonic transducers
Hoyd-Gigg Ng, Jack, Flynn, David, Lacrotte, Yves, Desmulliez, Marc P.Y., Ssekitoleko, Robert, Demore, Christine, Cochran, SandyYear:
2010
Language:
english
DOI:
10.1109/estc.2010.5642978
File:
PDF, 697 KB
english, 2010