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[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Surface activated bonding and transfer of Carbon Nanotube bumps to Au substrates
Fujino, Masahisa, Terasaka, Hidenori, Suga, Tadatomo, Soga, Ikuo, Konde, Daiyu, Ishizuki, Yoshikatsu, Iwai, TaisukeYear:
2012
Language:
english
DOI:
10.1109/ltb-3d.2012.6238079
File:
PDF, 1.03 MB
english, 2012