[IEEE Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, USA (7-9 June 2004)] Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) - Direct deposition of Cu/barrier stacks on dielectric/nonconductive layers using supercritical CO/sub 2/
Kondoh, E., Hishikawa, M., Yanagihara, M., Shigama, K.Year:
2004
Language:
english
DOI:
10.1109/iitc.2004.1345675
File:
PDF, 217 KB
english, 2004