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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Influence of mixed rare earth addition on the microstructure of the Sn-Cu-Ni solder and interfacial reaction of Cu/Sn-Cu-Ni/Cu joints
Wei, Li, Min-Bo, Zhou, Xiao, Ma, Xin-Ping, ZhangYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066825
File:
PDF, 2.90 MB
english, 2011