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[IEEE IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging - Scottsdale, AZ, USA (23-25 Oct. 2000)] IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) - CPAM: a common power analysis methodology for high-performance VLSI design
Neely, J.S., Chen, H.H., Walker, S.G., Venuto, J., Bucelot, T.J.Year:
2000
Language:
english
DOI:
10.1109/epep.2000.895550
File:
PDF, 297 KB
english, 2000