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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Structural design, process, and reliability of a wafer-level 3D integration scheme with Cu TSVs based on micro-bump/adhesive hybrid wafer bonding
Ko, C. T., Hsiao, Z. C., Chang, Y. J., Chen, P. S., Huang, J. H., Fu, H. C., Huang, Y. J., Chiang, C. W., Lee, C. K., Chang, H. H., Tsai, W. L., Chen, Y. H., Lo, W. C., Chen, K. N.Year:
2012
Language:
english
DOI:
10.1109/ectc.2012.6248797
File:
PDF, 2.01 MB
english, 2012