Effect of Thermal Aging on the Microstructure Evolution and...

IEEE Transactions on Components and Packaging Technologies 2008 / 12 Vol. 31; Iss. 4

Effect of Thermal Aging on the Microstructure Evolution and Solder Joint Reliability in Hard Disk Drive Under Mechanical Shock

Chen, Hongtao, Wang, Chunqing, Li, Mingyu, Tian, Dewen
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2008.2007930
Date:
December, 2008
File:
PDF, 3.66 MB
english, 2008
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