![](/img/cover-not-exists.png)
[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Early fatigue failures in copper wire bonds inside packages with low CTE green mold compounds
Vandevelde, Bart, Willems, GeertYear:
2012
Language:
english
DOI:
10.1109/ESTC.2012.6542110
File:
PDF, 323 KB
english, 2012