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[IEEE 2011 22nd Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - Saratoga Springs, NY, USA (2011.05.16-2011.05.18)] 2011 IEEE/SEMI Advanced Semiconductor Manufacturing Conference - Scaling of copper seed layer thickness using plasma-enhanced ALD and an optimized precursor
Mao, Jiajun, Eisenbraun, Eric, Omarjee, Vincent, Korolev, Andrey, Dussarrat, ChristianYear:
2011
Language:
english
DOI:
10.1109/ASMC.2011.5898176
File:
PDF, 517 KB
english, 2011