Modeling and characterization of the polymer stud grid...

IEEE Transactions on Electronics Packaging Manufacturing 2003 / 01 Vol. 26; Iss. 1

Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification

Chandrasekhar, A., Vandevelde, B., Driessens, E., Beyne, E., De Raedt, W., Pieters, P., Nauwelaers, B., Van Puymbroeck, J.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
26
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2003.813009
Date:
January, 2003
File:
PDF, 2.64 MB
english, 2003
Conversion to is in progress
Conversion to is failed