Characterization of Copper Electromigration Dependence on Selective Chemical Vapor Deposited Cobalt Capping Layer Thickness
Yang, C.-C., Baumann, F., Wang, P.-C., Lee, SY, Ma, P., AuBuchon, J., Edelstein, D.Volume:
32
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/led.2011.2108260
Date:
April, 2011
File:
PDF, 458 KB
english, 2011