Reliability issues of low-cost overmolded flip-chip...

IEEE Transactions on Advanced Packaging 2005 / 02 Vol. 28; Iss. 1

Reliability issues of low-cost overmolded flip-chip packages

Yaomin Lin,, Wenning Liu,, Yifan Guo,, Shi, F.G.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2004.841670
Date:
February, 2005
File:
PDF, 3.40 MB
english, 2005
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