Parylene Interposer as Thin Flexible 3-D Packaging Enabler...

IEEE Transactions on Microwave Theory and Techniques 2011 / 12 Vol. 59; Iss. 12

Parylene Interposer as Thin Flexible 3-D Packaging Enabler for Wireless Applications

Maeng, Jimin, Kim, Byungguk, Ha, Dohyuk, Chappell, William J.
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Volume:
59
Language:
english
Journal:
IEEE Transactions on Microwave Theory and Techniques
DOI:
10.1109/tmtt.2011.2172626
Date:
December, 2011
File:
PDF, 1.03 MB
english, 2011
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